Specifications

• Xilinx XC3S1500-4FGG456C

  Feature		XC3S1500
  System Gates		1500 K
  Logic Cells		29,952
  Maximum Distributed RAM Bits		208 K
  Maximum user I/O pins(Device)		333
  Maximum user I/O pins(Board)		100
  Total Block RAM Bits		576 K
  Multipliers		32
  DCMs		4

• Configuration Device Platform Flash (Xilinx XCF04S)
  one device for 1000/two devices for 1500/2000
• 100 I/O PAD 100 mil (2.54 mm) grid
• 4 external VCCO inputs are available.
• 48 MHz/18.432 MHz Oscillator(50 ppm)or External
• Two status LEDs (Power, Done )
• SDRAM 256 M(16 M x 16)(Micron MT48LC16M16A2P-75-D)
• External VREF input is available.
• Power-on Reset IC
• JTAG port(10 pin Header)
• JTAG buffer for stable download or debug
• 3.3 V single power supply operation with on-board 1.2 V/2.5 V regulators
• High quality eight layers PCB.(Immersion gold)
• Credit-Card-Size 3.386"x 2.126" (86 x 54 mm)
• Tested all I/O
• RoHS compliance
• MADE IN JAPAN

Package Contents

Item	Image	Quantity
FPGA board(XCM-005-xxxx)		1
Pin Headers		2
Sockets		2

There is no paper document such as user's manual and circuit schematic in the package.
Please download those documents from the link in the documentation section below.

Documentation

• User's manual, Schematic , etc