Specifications

• Xilinx XC3S400-4TQG144C

  Feature	XC3S400
  System Gates	400 K
  Logic Cells	8,064
  Maximum Distributed RAM Bits	56 K
  Maximum user I/O pins(Device)	97
  Maximum user I/O pins(Board)	90
  Total Block RAM Bits	288 K
  Multipliers	16
  DCMs	4

• Configuration Device Platform Flash (Xilinx XCF02SV0G20C)
• 90(91) I/O PAD 100 mil (2.54 mm) grid
• 48 MHz Oscillator(50 ppm),ECS-300(18.432 MHz/72 kHz)or External
• Two Status LEDs(Power, Done)
• Power-on Reset IC
• JTAG port(10 pin Header)
• JTAG buffer for stable download or debug
• 3.3 V single power supply operation with on-board 1.2 V/2.5 V regulators
• High quality four layers PCB.(Immersion gold)
• Credit-Card-Size 3.386"x 2.126" (86 x 54 mm)
• Tested all I/O
• RoHS compliance
• MADE IN JAPAN

Package Contents

Item	Image	Quantity
FPGA board(XCM-008-400)		1
Pin Headers		2
Sockets		2

There is no paper document such as user's manual and circuit schematic in the package.
Please download those documents from the link in the documentation section below.

Documentation

• User's manual, Schematic , etc