Specifications

• Xilinx XC3SD1800A-4FGG676C or
  Xilinx XC3SD3400A-4FGG676C

  Feature	XC3SD1800A	XC3SD3400A
  System Gates	1800 K	3400 K
  Logic Cells	37,440	53,712
  Maximum Distributed RAM Bits	260 K	373 K
  Maximum user I/O pins(Device)	519	469
  Maximum user I/O pins(Board)	100	100
  Maximum Differential I/O Pairs	227	213
  Total Block RAM Bits	1512 K	2268 K
  DCMs	8	8
  DSP48As	84	126

• Configuration Device(ST SP1-ROM M25P16)
• 100 I/O PAD 100 mil (2.54 mm) grid
• Separable VCCO
• 50 MHz Oscillator(50 ppm)or External
• One User Push-Button Switch
• Two User LEDs
• Three Status LED(Power,Done,Awake)
• SDRAM 256 M(16 M x 16)(Micron MT48LC16M16A2P-75-D)
• FRAM 256 kbit(32 K x 8)(Ramtron FM18L08-70-SG)
• Power-on Reset IC
• JTAG port(7 pin socket)
• JTAG buffer for stable download or debug
• 3.3 V single power supply operation
  with on-board 1.2 V regulatos
• High quality six layers PCB.(Immersion gold)
• Credit-Card-Size 3.386"x 2.126" (86 x 54 mm)
• Tested all I/O
• RoHS compliance
• MADE IN JAPAN

Package Contents

Item	Image	Quantity
FPGA board(XCM-016-xxx)		1
Pin Headers		2
Sockets		2

There is no paper document such as user's manual and circuit schematic in the package.
Please download those documents from the link in the documentation section below.

Documentation

• User's manual, Schematic , etc