Specifications

• Xilinx XC3S700AN-4FGG484C

  Feature	XC3S700AN
  System Gates	700 K
  Logic Cells	13,248
  Maximum Distributed RAM Bits	92 K
  Maximum user I/O pins(Device)	372
  Maximum user I/O pins(Board)	128
  Total Block RAM Bits	360 K
  Multipliers	20
  DCMs	8

• 128 I/O tow 80 pin HIROSE connectors
• 50 MHz Oscillator(50 ppm)or External
• One User Push-Button Switch
• Two User LEDs
• Three Status LEDs(Power, Done,Awake)
• Power-on Reset IC
• JTAG port(7 pin socket)
• JTAG buffer for stable download or debug
• 3.3 V single power supply operation with on-board 1.2 V regulator
• High quality six layers PCB.(Immersion gold)
• Compact size 1.693" x 2.126" (43 x 54 mm)
• Tested all I/O
• RoHS compliance
• MADE IN JAPAN

Package Contents

Item	Image	Quantity
FPGA board(XCM-108-xxx)		1
Sockets(HIROSE 80P)		2

There is no paper document such as user's manual and circuit schematic in the package.
Please download those documents from the link in the documentation section below.

Documentation

• User's manual, Schematic , etc