Sockets for High Bandwidth Applications

Diamond particle GHz interconnect (DG) technology allows very high frequency response and very wide temperature range sockets. DG socket is particularly effective for QFN and LGA with very low series resistance but requires tight co-planarity.

Standard Parts

• 40 GHz DG-QFN
• 40 GHz DG-LGA

Technical Documents

• Diamond Particle Interconnect Specification
• Ironwood Socket Technologies

DG socket technology is designed for wide range of IC package sizes to operate at bandwidths up to 40 GHz with less than 1dB of insertion loss, temperature range to 200C, and high number of insertions. The tables below show the sockets that are available immediately. In addition custom sockets using these technologies can be in your hands in a matter of weeks. DG sockets are mechanically mounted over a target system's QFN lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry's smallest footprint) and are compatible with the alternate socket technologies footprint as well. The sockets have a precision design, which guides the IC pad to the exact position for connection to corresponding PCB pad and uses an aluminum heat sink screw to provide compressive force. The sockets are designed to dissipate up to several watts without extra heat sinking and can handle up to 100 watts with a custom heat sink. The user simply places the IC into the socket, places the compression plate, swivels the lid, and applies torque to heat sink screw to connect the IC.

Diamond particle contactor is a low resistance (<0.01ohms) connector.  The contactor consists of diamond particles embedded into the circuitry on a Kapton or Teflon PCB. The diamond particles along with the circuitry are plated with gold over nickel. At compressed state, the distance between DUT pad and PCB pad is 0.001". This is very similar to soldering the DUT to PCB which makes the DG interconnect transparent to electrical signal.

Typical specifications for the interconnect include:

1. Contact resistance under 3 milliOHMS
2. Inductance and Capacitance approaches zero
3. 40 GHz bandwidth
4. 10-12 grams per contact
5. -70C to 200C
6. 100,000 insertions
7. Pitch down to 0.4mm

If there is no room to put mounting holes for socket on a customer's board, the socket can be used with alternate SMT options or with Thru hole options.