Specifications

• Xilinx XC6SLX45-2FGG484C or
  Xilinx XC6SLX75-2FGG484C or
  Xilinx XC6SLX100-2FGG484C or
  Xilinx XC6SLX150-2FGG484C

  Feature	XC6SLX45	XC6SLX75	XC6SLX100	XC6SLX150
  Slices	6,822	11,662	15,822	23,038
  Logic Cells	43,661	74,637	101,261	147,443
  Maximum Distributed RAM Bits	401	692	976	1,355
  Maximum user I/O pins(Device)	316	316	316	316
  Maximum user I/O pins(Board)	100	100	100	100
  Total Block RAM Bits	2,088	3,096	4,824	4,824
  DSP48Es	58	132	180	180

This table is for reference. Please refer to official datasheets for cirtain information.  

• 100 user I/O, 100 mil(2.54 mm) dual in-line.
• Separable VCCO
• On-board Oscillator, 30MHz and 50MHz(LVTTL)
• SPI-ROM(Numonyx: M25P32 (LX45/LX75) or M25P64 (LX100/LX150)
• DDR2 SDRAM(Micron: MT47H32M16HR-3:F, 512Mbit)
• MRAM(Everspin: MR2A16AYS35, 4Mbit)
• Three User Switchs
• Eight User LEDs
• Two Status LEDs(Power, Done)
• Power-on Reset IC for FPGA configuration
• JTAG port(7 pin socket)
• JTAG buffer for stable download and debug
• 3.3 V single power supply operation with on-board 0.9 V/1.2 V/1.8 V regulators
• High quality eight layers PCB.(Immersion gold)
• Credit-Card-Size 3.386"x 2.126" (86 x 54 mm)
• Tested all I/O
• RoHS compliance
• MADE IN JAPAN

Package Contents

Item	Image	Quantity
FPGA board(XCM-018-xxx)		1
Pin Headers		2
Sockets		2

There is no paper document such as user's manual and circuit schematic in the package.
Please download those documents from the link in the documentation section below.

Documentation

• User's manual, Schematic , etc