Measuring only 70mm by 50mm, the MYC-AM335X is a highly-integrated low-cost ARM embedded SOM (System on Module) supporting Texas Instruments (TI) Sitara AM335x (AM3352, AM3354, AM3356, AM3357, AM3358 and AM3359) ARM Cortex-A8 processors, featuring PowerVR™ SGX530 for 2D and 3D graphics acceleration as well as PRU/ICSS supporting real-time protocols such as EtherCAT, PROFINET, EtherNet/IP, PROFIBUS, Ethernet Powerlink, Sercos, and others.

The MYC-AM335X CPU Module has integrated the TI AM335x processor, 512MB DDR3 SDRAM, 512MB Nand Flash and Gigabit Ethernet PHY chip on board and can be served as the core of your embedded system. It has two 2.0mm pitch 60-pin male expansion connectors for interconnecting with your base board, thus providing an interface for the base board to carry most of the I/O signals to and from the CPU module. One 2.0mm pitch 26-pin interface and one 2.54mm pitch 10-pin interface are also designed with only reserved solder joints which have extended a few signals for some special purpose.

MYC-AM335X Top-view                                                                      MYC-AM335X Bottom-view

The MYC-AM335X CPU Module series have six models with different AM335x processors. They are sharing the same pin-out with software fully compatible.

MYC-AM3352 CPU Module for TI AM3352

MYC-AM3354 CPU Module for TI AM3354

MYC-AM3356 CPU Module for TI AM3356

MYC-AM3357 CPU Module for TI AM3357

MYC-AM3358 CPU Module for TI AM3358

MYC-AM3359 CPU Module for TI AM3359

You can get to know the main differences of the six Sitara ARM Cortex-A8 processors from below image.

AM335x Devices Comparison

The MYC-AM335X is the core of the MYD-AM335X development board which is a full-featured evaluation platform for users developing applications with Linux, Android and WinCE. Many peripheral interfaces such as two serial ports, four USB Host ports, one USB OTG port, dual Gigabit Ethernet ports, one CAN, one RS485, one Micro SD, HDMI, LCD, Touch screen have been carried out by headers and connectors on the base board. It can work in harsh environment supporting -40 to +85 Celsius extended temperature operation and make it ideal for industrial embedded applications such as automotive, control systems, lighting, refining and processing.

MYD-AM335X Development Board

Features

Mechanical Parameters

• Dimensions: 70mm x 50mm
• PCB Layers: 6-layer design
• Power supply: +3.3V/0.8A
• Working temperature: 0~70 Celsius (commercial grade) or -40~85 Celsius (industrial grade)
  

OS Support

• Linux 3.2.0
• Android 4.2.2
• Windows CE7

Processor

• TI AM3352, AM3354, AM3356, AM3357, AM3358, AM3359 (pin-to-pin compatible, 15x15 mm, 0.8-mm ball pitch, ZCZ package)
  - 800-MHz ARM Cortex-A8 32-bit RISC MPU (Up to 1GHz)
  - NEON™ SIMD Coprocessor
  - 32KB/32KB of L1 Instruction/Data Cache with Single-Error Detection (parity)
  - 256KB of L2 Cache with Error Correcting Code (ECC)
  - SGX530 Graphics Engine
  - Programmable Real-Time Unit Subsystem

Memory

• 512MB DDR3 SDRAM
• 512MB Nand Flash

Peripherals and Signals Routed to Pins

• On-board Gigabit Ethernet PHY
• One power indicator (Red LED)
• One user LED (Green)
• Two 2.0mm pitch 60-pin expansion connectors can carry out interfaces below
  - 2 x USB2.0 OTG ports
  - 6 x Serial ports
  - 2 x I2C
  - 1 x SPI
  - 7 x ADC
  - 2 x PWM
  - 3 x SDIO
• One 2.0mm pitch 26-pin expansion interface
• One 2.54mm pitch 10-pin expansion interface

Hardware Specification

The TI AM335x microprocessors, based on the ARM Cortex-A8, operating at up to 1GHz, are enhanced with image, graphics processing, peripherals and industrial interface options such as EtherCAT and PROFIBUS. The device

supports the following high-level operating systems (HLOSs) that are available free of charge from TI:

• Linux?

• Android™

The AM335x microprocessor contains these subsystems:

• Microprocessor unit (MPU) subsystem based on the ARM Cortex-A8 microprocessor.

• POWERVR SGX™ Graphics Accelerator subsystem for 3D graphics acceleration to support display

and gaming effects.

• The Programmable Real-Time Unit and Industrial Communication Subsystem (PRU-ICSS) is separate

from the ARM core, allowing independent operation and clocking for greater efficiency and flexibility.

The PRU-ICSS enables additional peripheral interfaces and real-time protocols such as EtherCAT,

PROFINET, EtherNet/IP, PROFIBUS, Ethernet Powerlink, Sercos, and others.

Function Block Diagram of MYC-AM335X

Dimension Chart of MYC-AM335X

Relative Download and Links

You can download relative chip datasheet, products datasheet, user manual, software package from below. Any inquiry, please contact MYIR.

1	TI AM335x Datasheet	2.80 MB
2	TI AM335x Technical Reference Manual	19.7 MB
3	MYC-AM335X CPU Module Overview	844 KB
4	MYD-AM335X Development Board Overview	1.12 MB
5	MYC-AM335X CPU Module Dimensions	111 KB
6	MYD-AM335X Development Board Dimensions	138 KB