Specifications

• Xilinx XC6SLX4-2TQG144C or XC6SLX9-2TQG144C

  Feature	XC6SLX4	XC6SLX9
  Slices	600	1430
  Logic Cells	3,849	9,152
  Maximum Distributed RAM Bits	75 K	90 K
  Maximum user I/O pins(Device)	132	200
  Maximum user I/O pins(Board)	56	56
  Total Block RAM Bits	216 K	576 K

  This table is for reference. Please refer to official data-sheets for certain information.

• 3.3 V single power supply operation with on-board 1.2 V regulator
• Configuration Device (Micron, M25P16)
• 50 MHz Oscillator (50 ppm) and External inputs
• User Switch (DIP x1 bit)
• User LED (x1)
• Status LED (Power, Done)
• 56 I/O PAD 100 mil (2.54 mm) grid
• Power-on Reset IC
• JTAG connector (7 pin socket)
• JTAG buffer for stable download and debug
• High quality six layers PCB.(Immersion gold)
• Compact size 2.087" x 2.126" (53 x 54 mm)
• Tested all I/O
• RoHS compliance
• MADE IN JAPAN

Package Contents

Item	Image	Quantity
FPGA board(XCM-306-***)		1
Pin Headers		2

There is no paper document such as user's manual and circuit schematic in the package.
Please download those documents from the link in the documentation section below.

Documentation

• User's manual, Schematic , etc