The Trenz Electronic Starter Kit TE0808-04-09-2IE-S consists of a TE0808-04-09EG-2IE module with ZU9 on a TEBF0808-04 base board including a pre-assembled heatsink, in a black Core V1 Mini-ITX Enclosure. Supplied with a Be Quiet! 400W power supply for the enclosure, 2 x XMOD FTDI JTAG Adapter, an 8 GB micro SD card, an USB cable, screws and bolts.

TE0808-04-09-2IE

The Trenz Electronic TE0808-04-09EG-2IE is a MPSoC module with industrial temperature grade integrating a Xilinx Zynq UltraScale+, 4 GByte DDR4 SDRAM with 64-Bit width, 128 MByte Flash memory for configuration and operation, 20 Gigabit transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections. 

TE0808-04-09-2IE Key Features

• Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I
• ZU9EG 900 Pin Packages
• 3 mm mounting holes for skyline heat spreader
• Size: 52 x 76 mm
• B2B Connectors: 4 x 160 pin
• Rugged for shock and high vibration
• 4 GByte 64-Bit DDR4 SDRAM
• 128 MByte SPI Boot Flash (dual parallel)
• User I/Os
  • 65 x PS MIOs, 48 x PL HD GPIOs, 156 x PL HP GIPIOs (3 banks)
  • Serial transceivers: 4 x GTR + 16 x GTH
  • Transceiver clocks inputs and outputs
  • PLL clock generator inputs and outputs
• Si5345 - 10 output PLL
• All power supplies on board, single 3.3V Power required
  • 14 on-board DC/DC regulators and 13 LDOs
  • LP, FP, PL separately controlled power domains
• Support for all boot modes (except NAND) and scenarios
• Support for any combination of PS connected peripherals
• Evenly spread supply pins for good signal integrity.

TEBF0808-04 Base board

The Trenz Electronic TEBF0808 UltraITX+ base board has been developed individually for the TE0808 UltraSOM+ MPSoC.

Key Features TEBF0808-04

• Mini-ITX form factor
• ATX Power supply connector (12V only PS Required)
• optional 12V Standard Power Plug
• USB3 with USB3 HUB
• Gigabit Ethernet RJ45
• MicroSD Card (bootable)
• eMMC (bootable)
• PCIe slot - PS GT Connected, one PCIe lane (16 Lane Connector)
• Displayport Single Lane PS GT Connected
• One SATA Connector
• FMC HPC Slot (1.8V max VCCIO)
• Dual SFP+
• One Samtec FireFly (4 GT lanes bidir)
• One Samtec FireFly connector for reverse loopback
• Fan connectors, PC Enclosure, FMC Fan
• Intel front panel connector (PWR/RST/LED)
• Intel HDA Audio connector
• CAN FD Transceiver (10 Pin IDC Connector)
• 20 Pin ARM JTAG Connector (PS JTAG0)

PC Enclosure Accessible I/O

• PCIe
• FMC
• Dual SFP+
• RJ45 Gigabit Ethernet
• 2x USB3 Host
• Displayport
• microSD
• Two LED's
• CAN FD (using DB9 to IDC10 Cable)

Core V1 Mini-ITX Gehäuse - technical features

• Dimensions: 260 x 276 x 316 mm (B x H x T)
• Material: Steel
• Colour: Black
• Drive Slots: 2 x 3,5 Zoll (intern, 3,5 Zoll) and 2 x 2,5 Zoll (intern, 2,5 Zoll)
• Expansion slots: 2
• I/O-Panel: 2 x USB 3.0 and 1 x Audio In/Out each
• Maximum graphic card lenght: 255 mm (inner enclosure)
• Maximum graphic card lenght: 285 mm (outer enclosure)
• Maximum CPU cooler height: 140 mm
• Maximum lenght power supply: 200 mm

Package Content Starter Kit

• 1 x Core V1 Mini-ITX Enclosure- black with viewing window and removable sled walls
• 1 x Power Supply Be quiet! BN142 System Power 7, 400 Watt, 12V, ATX 2.3 with fan
• 1 x TE0808-04-09-2IE with ZU9
• 1 x TEBF0808-04 base board
• 1 x Heatsink MBH31001-15W/2.6, pre-assembled
• 1 x TE0790-02 XMOD FTDI JTAG Adapter (compatible with Xilinx-Tools), pre-assembled
• 1 x TE0790-02L XMOD FTDI JTAG Adapter (independent from Xilinx-Tools), pre-assembled
• 1 x 8 GB Class 4 microSDHC card
• 1 x USB cable, Typ A to Typ B Mini, 2 meter length
• 2 x Phillips screws, M3 x 6, pan head, zinc coated
• 2 x Spacer bolts, M3, 10 mm

Additional Information

• Manufacturer's article number: TE0808-04-09-2IE-S
• Trenz Electronic TE0808 Starter Kit Wiki
• Support Forum