Powerful industrial grade micromodule contains Spartan™ 3E FPGA, DDR Memory and USB 2.0 Microcontroller

The FPGA micromodule integrates a Spartan™ 3E 1600K gates FPGA, an USB 2.0 microcontroller, DDR RAM, configuration Flash and power supply on a tiny footprint. A large number of configurable I/Os are provided via shock proof B2B mini-connectors.

Thus, the Micromodule is ideally suited for battery-powered and small-sized applications.

It is intended to be used as an OEM board, or combined with our carrier boards, the micromodule serves as a powerful system widely used for educational and research activities.

Software for SPI Flash programming over USB, as well as reference designs for high speed data transfer over USB are included.

Key features

• Small and ruggedized design
• Versatile
• x16 DDR with up to 666 MByte/s bandwidth
• Supports OPB and MIG DDR cores
• 3 on-board DC-DC converters for high efficiency
• All parts with industrial grade temperature range

Specification

• AMD/Xilinx Spartan™ 3E FPGA XC3S1600E-4FGG320I
• Cypress FX2 USB2.0 CY7C68013A-56LFXI
• Onboard 125 MHz oscillator for high performance
• 32 MBit SPI Flash for configuration and user data
• 512 MBit DDR RAM
• 104 I/Os + 6 inputs available on B2B connectors
• 2 x 80 pin Hirose DF17 shockproof B2B connectors
• 1 x LED
• 1 x push button
• Power supply input via USB, or B2B
• Programming is implemented via JTAG, SPI or USB (the required adaptor is not included)
• Size only 40.5 mm x 47.5 mm

Scope of Delivery

• 1 x TE0300-01IBM Trenz Electronic FPGA module with AMD/Xilinx Spartan™ 3E FPGA

Available for download

• User's manuals
• Product brief
• Application notes
• Demo project files
• Schematics and placeplan
• CAD library files
• Data sheets of major components

Recommended Accessories

• JTAG adapter (the onboard USB firmware update is useful for fieldupdates, but not suitable for development)

Additional Information

• Manufacturer's article number: TE0300-01IBM
• Trenz Electronic TE0300 Wiki
• Example projects
• Support Forum