The Trenz Electronic Starter Kit TE0818-02-9BE81-AS consists of a TE0818-02-9BE81-A module with ZU9 on a TEBF0818-02 base board including a pre-assembled heatsink, in a black Core V1 Mini-ITX Enclosure. Supplied with a Be Quiet! 400 W power supply for the enclosure, two mounted XMOD FTDI JTAG Adapter, an 32 GB micro SD card, an USB cable, a power cable and screws.

The Module: TE0818-02-9BE81-A

The Trenz Electronic TE0818-02-9BE81-A is a MPSoC module integrating a AMD/Xilinx Zynq™ UltraScale+™ ZU9EG, 4 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, 20 x high speed serial transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

Key Features

• SoC / FPGA
  • Device: AMD/Xilinx Zynq™ UltraScale+™ XCZU9EG-1FFVC900E
  • Speedgrade: -1
  • Temperature range: Extended
  • Package: FFVC900
  • Grafikprozessor-Unit (GPU)

• RAM / Storage
  • 4 GByte DDR4 SDRAM
  • 128 MByte SPI Boot Flash (dual parallel)
  • 2 Kbit serial EEPROM with EUI-48 Node Identity

• On Board
  • Oscillator
  • Programmable 10-channel PLL clock generator

• Interface
  • Plug-on module with 4 x 240 pin B2B connectors (ADM6)
    • 204 PL IO
      • HP: 156
      • HD: 48

    • 65 PS MIO

    • 4 PS GTR
    • 16 PL GTH
    • I2C, JTAG
  • 2 Transceiver clocks
  • PLL Clock Generator
  • LP, FP, PL separately controlled power domains

• Power
  • 14 on-board DC/DC regulators and 13 LDOs, Single Supply

• Dimension
  • 5.2 x 7.6 cm

The Base Board: TEBF0818-02

The Trenz Electronic TEBF0818 UltraITX+ base board has been developed individually for the TE081x MPSoC series.

Key Features

• Mini-ITX form factor, PC enclosure compatible
• ATX-24 power supply connector
• Optional 12V standard power plug
• Headers
  • Intel 10-pin HDA audio
  • Intel 9-pin power/reset button, Power-/HD-LED
  • PC-BEEPER
• On-board power-/reset-switches
• 2 x configuration 4-bit DIP switches
• 2 x optional 4-wire PWM fan connectors
• PCIe slot - one PCIe lane (16 lane connector)
• CAN FD transceiver (10 Pin IDC connector and 6-pin header)
• 4 x On-board configuration EEPROMs (1 x Microchip 24LC128-I/ST, 3 x Microchip 24AA025E48T-I/OT)
• Dual SFP+ connector (2x1 Cage)
• 1 x DisplayPort (single lane)
• 1 x SATA connector
• 2 x USB 3.0 A connector (Superspeed Host Port (Highspeed at USB 2.0))
• 1 x USB 3.0 on-board connector with two ports
• FMC HPC slot (FMC_VADJ max. VCCIO)
• FMC fan
• Gigabit Ethernet RGMII PHY with RJ45 MagJack
• All carrier board peripherals' I²C interfaces muxed to MPSoC's I²C interface
• Quad programmable PLL clock generator
• 2 x SMA coaxial connectors for clock signals
• MicroSD/MMC card socket (bootable)
• 64 GBit (8 GByte) on-board eMMC Flash
• 2 x System controller CPLDs Lattice MachXO2 1200 HC
• 1 x Samtec FireFly (4 GT lanes bidirectional)
• 1 x Samtec FireFly connector for reverse loopback
• 20-pin ARM JTAG connector (PS JTAG0)
• 3 x Pmod connector (GPIO's and I²C interface to SC CPLDs and MPSoC module)
• On-board DC-DC PowerSoCs
• Size: 170 mm × 170 mm. Please download the assembly diagram for exact details.
• Mating height with standard connectors: 5 mm

PC Enclosure Accessible I/O

• PCIe
• FMC
• Dual SFP+
• RJ45 Gigabit Ethernet
• 2 x USB3 Host
• Displayport
• microSD
• Two LEDs
• CAN FD (using DB9 to IDC10 Cable)

Core V1 Mini-ITX Enclosure - Technical Features

• Dimensions: 260 x 276 x 316 mm (B x H x T)
• Material: Steel
• Colour: Black
• Drive Slots: 2 x 3.5 inch (intern, 3.5 inch) and 2 x 2.5 inch (intern, 2.5 inch)
• Expansion slots: 2
• I/O-Panel: 2 x USB 3.0 and 1 x Audio In/Out each
• Maximum graphic card lenght: 255 mm (inner enclosure)
• Maximum graphic card lenght: 285 mm (outer enclosure)
• Maximum CPU cooler height: 140 mm
• Maximum lenght power supply: 200 mm

Scope of Delivery - Starter Kit

• 1 x Core V1 Mini-ITX Enclosure- black with viewing window and removable sled walls
• 1 x Power supply Be quiet! BN292 Be Quiet! Pure Power 11, 400W, 80 PLUS (with fan)
• 1 x TE0818-02-9BE81-A MPSoC module with AMD/Xilinx Zynq™ UltraScale+™ ZU9
• 1 x TEBF0818-02 base board
• 1 x Heatsink SuperGrip ATS-X50310P-C1-R0 31 x 31 x 17,5 mm
• 1 x TE0790-03 XMOD FTDI JTAG adapter (compatible with AMD-Tools), pre-assembled on the carrier board
• 1 x TE0790-03L XMOD FTDI JTAG adapter (independent from AMD-Tools), pre-assembled on the carrier board
• 1 x 32 GB Class 10 UHS1 microSDHC incl. adapter
• 1 x USB cable, Type A to Type B Mini, 2 meter length
• 1 x power cable Schuko 1.8m black
• 4 x Phillips screws, M3 x 6, pan head, zinc coated

Additional Information

• Manufacturer's article number: TE0818-02-9BE81-AS
• Trenz Electronic TE0818 Starter Kit Wiki
• Support Forum