Flagship—

Xilinx Zynq UltraScale + MPSoC  FPGA High-end FPGA Board

Support XILINX Vitis-AI DPU，Support PCIe 3.0 x16，Dual FMC HPC interface
       

Satisfies network communication, high-speed data exchange storage, industrial control, in-depth learning, AI intelligence, cloud computing, 4K video transmission processing, and aerospace applications

·ARM CPU

• Quad Core ARM Cortex™-A53 + Dual Core ARM Cortex™-R5

·GPU

• Mali™-400 MP2 GPU

·18GB DDR4

• PS 10GB DDR4、PL 8GB DDR4

·FLASH RAM

• 32GB eMMC FLASH、128MB QSPI FLASH

key Features

·Core Board SOM

 

*Click the picture above to view the details of the core board>>

 

 

·FPGA Board

PRODUCT PARAMETERS

Board Parameter Comparison

SoM Module

ACU19EG

FPGA Chip

XCZU19EG-2FFVC1760I

Chip CPU

ARM Cortex™-A53 x4, 1.333GHz，双核 Cortex™-R5, 533MHz

GPU

Mali™-400 MP2

RAM

PS DDR4，10GB，72bit， 2400Mbps,Support ECC
PL DDR4，8GB，64bit,  2400Mbps

PS side High-Speed Connection

PCIe® Gen2 x4, 2x USB3.0, SATA 3.1,DisplayPort, 4x Tri-mode Gigabit Ethernet

PS side General Connection

2xUSB 2.0, 2x SD/SDIO, 2x UART, 2x CAN 2.0B,2x I2C, 2x SPI, 4x 32b GPIO

Chip Level

Speed Grades: -2; Industrial Grade, Working Temperature -40°c~85°c

Logic Cells

1,143K

Flip-Flops

1,045K

LUTs

523K

Distributed RAM

9.8Mb

Block RAM

34.6Mb

UltraRAM

36.0Mb

CMTs

11

DSP Slices

1,968

150G Interlaken

4

100G Ethernet

4

PL PCIE Gen 3

PCIE Gen3 x5

PL GTH

12.5Gb/s x32

PL GTY

28.21Gb/s x16

PL HP I/O

240

PL HD I/O

96

eMMC FLASH

32GB

QSPI FLASH

128MB

Expansion port

8-way 120-pin 0.5mm spacing extension connector with Panasonic high-speed industrial grade board-to-board connector

Crystal oscillator

A RTC real-time clock provides 32.768 KHz real-time clock source for PS system
A single-ended 33.333MHz crystal vibration is supplied to the PS system clock input
1 Differential 200MHz crystal oscillation supplied to PL logic, DDR4 reference clock

Interface and Function

FMC Extension

Two standard FMC HPC extensions, external XILINX or ALINX various FMC subboards (HDMI input and output module, binocular camera module, high speed AD module, etc.)

PCIE 3.0 Interface

1-way PCIE 3.0 X16 interface for PCIE data communication with PCs

DP Output Interface

1-way standard Display Port output display interface for video image display with maximum support 4K@30Hz perhaps 1080P@60Hz Output.

Type-C interface

1-way USB3.0 Type-C interface, supporting HOST, SLAVE, OTG three modes

M.2 Interface

1-way PCIEx1 standard M.2 interface for connecting M. 2 SSD solid state hard disk, communication speed up to 6Gbps (SSD fixed hard disk needs self-purchase)

USB Serial Port

Two Uart to USB interfaces, one for PS and one for PL to communicate with computer for user debugging

Gigabit Ethernet

1-way 10/100/1000M Ethernet with RJ-45 Interfaces for Data Exchange

Differential Clock

2-way 156.25M Differential Reference Clock Input

JTAG

10-pin 2.54mm standard JTAG port for downloading and debugging of field programmers

Temperature sensor

A temperature sensor chip LM75A to detect ambient temperature

EEPROM

EEPROM 24LC04 with 1 piece of IIC interface

RTC Real Time Clock

1 built-in RTC real-time clock

TF card slot

1-way Micro SD card interface for storing operating system mirrors and file systems

LEDs

1 power indicator; 2 user lights, 1 DONE configuration light

Power Supply Parameters

Voltage Input

+12 V DC

Current Input

Max. Current 3A

Package List

FPGA Board

1

DC Fan (Fixed on the Board)

1

Mini USB Cable

1

USB Downloader Cable

1 Set

12V Power Adapter

1

PCIe Fence

1

TF Card

1

Card Reader

1

Structure Size

Size Dimension

225.81 mm x 106.65mm

Number of Layers

16-Layer Core Board PCB, 12-Layer Carrier Board PCB Reserve independent power layer and GND layer

 

High speed FMC HPC expansion interface

Automatic driving, medical, industrial and other widely used fields

 

Automatic driving of 16 way on-board camera, vehicle simulation, SDI 4K video, high-speed camera acquisition with Camera Link interface

 

 

 

 

 

XILINX VITIS-AI DPU

AI recognition detection, depth computing learning

 

Intelligent identification and detection, image and video processing, security monitoring, machine vision, fire monitoring,  
traffic safety, smart construction site, smart hotel, smart agriculture, Internet of Things

Vehicle Identification

Infrared Vehicle Identification

Pedestrian recognition

Indoor Person Recognition

Fire detection

Helmet detection

Concrete defect detection

PCB defect detection