Xilinx Zynq UltraScale + MPSoC FPGA Core board（Stamp hole）

4 x ARM® Cortex-A53 ,2 x Cortex-R5 processor

Mali-400 MP2 GPU，16nm FinFET+ Programmable Logic Integrated H.264 / H.265 video codec, codec up to 4Kx2K (60fps) videc Apply to Multimedia, Automotive ADAS, Surveillance, AI Intelligence Cloud Computing, High-speed Data Exchange and Storage and other Embedded Vision

·4GB DDR4

• PS 4GB DDR4

·FLASH storage

• 8GB EMMC FLASH、32MB QSPI FLASH

key Features

Product Performance

Main Parameters

Core board

M4EV

FPGA Chip

XCZU4EV-1SFVC784I

Speed Grades

-1

Working Temperature

Industrial Grade，-40°C~85°C

CPU kernel

4 x Cortex™-A53 | 2 x Cortex™-R5

CPU frequency

1.2GHz | 500MHz

GPU Graphic processing sheet

Mali™-400 MP2

High speed connection interface

PCIe Gen2 x1 , 1x USB3.0 , Sata 3.1 , DisplayPort 1x Tri-mode Gigabit Ethernet

Common connection interface

1x SD2.0, 1x JTAG

PS DDR4

4GB, 64bit

QSPI | EMMC Flash

32MB | 8GB

Logic Cells

192K

Flip-Flops

176K

LUTs

88K

Max. Distributed RAM

2.6Mb

Total Block RAM | UltraRAM

4.5Mb | 13.5Mb

Clock Management Tiles (CMTs)

4

DSP Slices

728

Video Codec Unit

H.264/H.265

PS MI/Os

15

PL I/Os

102

PL HPI/Os

96

PL HD I/Os

6

Connection mode

Stamp hole

 

Functions and interfaces

RAM

4GB DDR4, 64bit

QSPI Flash

One piece of 256Mbit QSPI flash, which can be used as FPGA user data storage

EMMC Flash

8GB, used in zynq system, can be used as a large capacity storage device of the system

Crystal oscillator

One passive crystal oscillator is provided to PS system

 

Power Supply Parameters

Voltage Input

+5 V DC

 

Package List

FPGA SoM Board

1

 

 

 

Structure Size

Size Dimension

70mm x 50mm

Number of Layers

16-Layer PCB

 

      

 

Super Combination with Mali™-400 MP2 GPU, 64bit DDR4 RAM

Industiral Grade Chip Dual ARM Application Processor

4x  ARM Cortex-A53，1.2GHz；2x Cortex™-R5， 500MHz；PS 4GB DDR4

 

HD video concept design

H.264 / H.265 video codec

It can encode and decode 4kx2k (60fps) video at the same time

Get Started Quickly ，Shorten Learning and Development Time

Provide Documents to Study

Provide Schematic, PCB, Size Dimension, Package and Reference Design, that to Accelerate the Development of products with Core Board