Specifications

• Xilinx XC3S200-4VQG100C

  Feature	XC3S200
  System Gates	200 K
  Logic Cells	4,320
  Maximum Distributed RAM Bits	30 K
  Maximum user I/O pins(Device)	63
  Maximum user I/O pins( Board )	56
  Total Block RAM Bits	216 K
  Multipliers	12
  DCMs	4

• Configuration Device Platform Flash(Xilinx XCF01SV0G20C)
• 56 I/O PAD 100 mil (2.54 mm) grid
• 48 MHz Oscillator(50 ppm)or External
• Three User LEDs.
• One User Push-Button Switch or One User LED(Selectable)
• Two Status LEDs(Power, Done)
• Power-on Reset IC
• JTAG port(7 pin Header)
• JTAG buffer for stable download or debug
• 3.3 V single power supply operation with on-board 1.2 V/2.5 V regulators
• High quality four layers PCB.(Immersion gold)
• Compact size 2.087" x 2.126" (53 x 54 mm)
• Tested all I/O
• RoHS compliance
• MADE IN JAPAN

Package Contents

Item	Image	Quantity
FPGA board(XCM-301-xxx)		1
Pin Headers		2

There is no paper document such as user's manual and circuit schematic in the package.
Please download those documents from the link in the documentation section below.

Documentation

• User's manual, Schematic , etc