The Trenz Electronic TEB0911 UltraRack+ board is integrating a AMD/Xilinx Zynq™ UltraScale+™ ZU9EG MPSoC with 2 x 64 MByte Flash memory for configuration and operation, 8 GByte DDR4-SDRAM SO-DIMM socket with 64-bit wide data bus, 22 MGT lanes and powerful switch-mode power supplies for all on-board voltages. The TEB0911 board exposes the pins of the Zynq MPSoC to accessible connectors and provides a whole range of on-board components to test and evaluate the Zynq™ UltraScale+™ MPSoC and for developing purposes. The board is capable to be fitted to a enclosure, whereby on the enclosure's rear and front panel, I/O's, LVDS-pairs and MGT lanes are accessible through 6 on-board FMC connectors and other standard high-speed interfaces, namely USB3, SFP+, SSD, GbE, etc.

Key Features

• Zynq™ UltraScale+™ MPSoC XCZU9EG-1FFVB1156E
  • 1156 Pin Package
• 8 GByte 64-Bit DDR4 SO-DIMM (PS connected)
• Active heat sink (serial number 638088 and above)
• M2 PCIe SSD (1-Lane)
• 8 GByte e.MMC (bootable)
• 2 x 64 MByte Dual QSPI Flash (bootable)
• System Controller(LCMXO2-7000HC)
  • Power Sequencing
  • IO Expander
• Configurable PLLs
• GTH/GTP Reference CLKs

Front Panel

• 4 x FMC
  • 4 GTH per FMC
  • 68 ZynqMP PL IO per FMC
• DisplayPort (2-Lanes)
• RJ34 ETH + Dual USB3 Combo
• Dual Stack SFP+
• SD (bootable)
• Status LEDs

Back Panel

• 2 x FMC
  • 4/2 GTH
  • 12 ZynqMP PL IO per FMC
• 56 SC IO per FMC
• USB JTAG/UART ZynqMP
• USB JTAG/GPIO FMC
• CAN FD (DB9 Connector)
• SMA (external CLK)
• 5-pin 24 V power connector

Board size

• 406 mm × 234.30 mm, please download the assembly diagram for exact details

Scope of Delivery

• 1 x TEB0911-04-9BEX1MA Trenz Electronic UltraRack+ MPSoC board with AMD/Xilinx Zynq™ UltraScale+™ ZU9EG
• 1 x active heat sink, pre-assembled

Additional Information

• Manufacturer's article number: TEB0911-04-9BEX1MA
• Trenz Electronic TEB0911 Wiki
• Support Forum