China PANGOMICRO Logos FPGA SoM Core Board
Suitable for high-speed data communication, video image processing, high-speed data acquisition, security, communication, industrial control, power, consumer electronics, and other applications
·512MB
内存 DDR3
·16MB
QSPI FLASH
·27072
LUT4
·33840
Flip-Flops
Technical support
All supporting materials are provided through Baidu Netdisk. After purchasing, please contact customer service to request them.
01. Installation of Pango Design Suite and modelsim
02. Led_ Test Flowing Water Lamp Experiment and Simulation
04. DDR3 Reading and Writing Test Experiment
05. IO testing experiment
Key Features
·Core board
Product Parameters
SoM Core Board Parameters
FPGA Chip
PGL25G6IMBG324
DDR3
512MB, 16bit
QSPI FLASH
16MB
LUT4
27072
Flip-Flops
33840
Distributed RAM(Kbit)
242
Block RAM(18Kbit/块)
60
Total Block RAMKbit)
1080
PLLs
4
APM(18*18)
40
Extended IOs
136
Voltage Adjustable IOs
102
LVDS
68
Speed Class
6
Working Temperature
Industrial Grade, Working Temperature -40°C~85°C
Interface and Function
RAM
1 x 512MB DDR3, 16bit
QSPI Flash
1x 16MB QSPI FLASH, Used for FPGA Configuration File and User Data Storage
crystal Oscillator
50 Mhz Provide Reference Input Clock for FPGA
JTAG Interface
10 pin 2.54mm standard JTAG port for downloading and debugging FPGA programs
Uart Interface
1 USB Uart interface for communication with PC or external devices and USB power input
40-pin Expansion Port
Four 40 pin expansion ports (2.54mm spacing), including 34 IO ports, one 5V power supply, two 3.3V power supplies, and three GNDs, which can be connected to the backplane or ALINX module
Power Supply Parameters
Voltage Input
+5V DC, Connect the computer to USB power supply, or the backplane to+5V power supply
Package List
FPGA Core Board
1
Plastic Pillars
4
Mini USB cable
1
40 rows of pins
2
结构尺寸
Size Dimension
2.95inch x 2.52inch
Number of Layers
Adopting an 8-layer PCB design with reserved independent power layer and GND layer
Get Started Quickly, Shorten Learning and Development Time
Provide Documents to Study
Provide Schematic(PDF), PCB(PDF), Size Dimension, Package and Reference Design, that to Accelerate the Development of products with Core Board
